Jong Eun Ryu
Assoc Professor
- Email: jryu@ncsu.edu
- Office: Engineering Building III (EB3) 3413
Dr. Jong Eun “Jon” Ryu joined NCSU in 2018. Dr. Ryu was an Assistant Professor at Indiana University-Purdue University Indianapolis (IUPUI) in 2013-2018. Dr. Ryu received his Ph.D. in Mechanical Engineering from the University of California, Los Angeles in 2009 and had received his BS and MS degrees from KAIST, Korea in 2004 and 2006, respectively. Right after his graduate research, Dr. Ryu completed a two-year postdoctoral training in the plasmonic sensors also at UCLA. Before he joined IUPUI, he worked for Intel Corp as a senior R&D engineer on the advanced semiconductor lithography technology.
Research Interests
Dr. Ryu’s research is focused on additive manufacturing, nanomanufacturing, and multifunctional composite materials with the applications of bio-inspired plasmonic sensing, tunable metamaterials, and 3-D printed stretchable electronics.
Education
| Degree | Program | School | Year |
|---|---|---|---|
| Ph.D. | Doctorate of Philosophy in Mechanical Engineering | University of California, Los Angeles | 2009 |
| MSME | Master of Science in Mechanical Engineering | Korea Advanced Institute of Science & Technology (KAIST), Daejeon | 2006 |
| BSME | Bachelor of Science in Mechanical Engineering | Korea Advanced Institute of Science & Technology (KAIST), Daejeon | 2004 |
Honors and Awards
- 2018 | Summer Faculty Fellowship to the Air Force Research Laboratory
- 2016 | Summer Faculty Fellowship to the Air Force Research Laboratory
- 2015 | Summer Faculty Fellowship to the Air Force Research Laboratory
Publications
- Flexoelectricity enables piezoelectric single crystals to be self-poled
- Choi, W.-J., Kim, S., Nam, H., Yu, H.-L., Lee, H.-Y., Moon, S., … Jo, W. (2026, April 9), Npj Flexible Electronics, Vol. 4. https://doi.org/10.1038/s41528-026-00575-z
- Co-Design and ML-Based Optimization of Through-Via in Silicon and Glass Interposers for Electronic Packaging Applications
- Zaghari, P., Sinha, S. S., Hopkins, D. C., & Ryu, J. E. (2025, January 8), IEEE Transactions on Components Packaging and Manufacturing Technology. https://doi.org/10.1109/TCPMT.2025.3527313
- Design, Fabrication, and Operation Challenges of Advanced Power Packaging Technology for EV Power Modules
- Sinha, S. S., Zaghari, P., Cheng, T.-H., Ryu, J. E., & Hopkins, D. C. (2025, April 8), 2025 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING, IWIPP. https://doi.org/10.1109/IWIPP61784.2025.10971570
- Electric field-induced depolarization of direct current and alternating current poled PMN-PT single crystals
- Sun, J.-W., Xu, Z., Lee, S.-G., Jo, W., Jiang, X., & Ryu, J. E. (2025, February 1), Applied Physics Letters, Vol. 126. https://doi.org/10.1063/5.0250172
- Enhanced domain dynamics in alternating current poled rhombohedral Pb(Mg 1/3 Nb 2/3 )O 3 –PbTiO 3 single crystals
- Sun, J. W., Fluerasu, A., Xu, Z., Liu, S., Lee, S. G., Jo, W., … Ryu, J. E. (2025, April 30), Journal of the American Ceramic Society, Vol. 4. https://doi.org/10.1111/jace.20610
- Experimental and numerical analysis of thermal performance and deformation in a lightweight composite bicycle brake disc
- Tseng, C.-W., & Ryu, J.-E. (2025, November 21), Smart Science. https://doi.org/10.1080/23080477.2025.2588207
- Innovative Packaging Strategy for MLCCs for High Current AC Applications Aimed at Reducing Parasitic Inductance
- Sinha, S. S., Zaghari, P., Ryu, J. E., & Hopkins, D. C. (2025, April 8), 2025 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING, IWIPP. https://doi.org/10.1109/IWIPP61784.2025.10971514
- Mesh Board with Pitched Blade Turbine Impeller to Prevent Agglomerate Formation
- Kaizawa, I., Hakoda, M., Tsuruta, N., Shibahara, R., Yano, K., Fukuma, K., … Ryu, J. (2025, May 1). , . https://doi.org/10.1109/ic_aset65966.2025.11231959
- Recent development in piezoelectric materials and devices for cryogenic environments
- Naderi, A., Liu, S., Fu, J., Xu, T., Zhang, S., Ryu, J. E., & Jiang, X. (2025, February 14), Sensors and Actuators A Physical, Vol. 5. https://doi.org/10.1016/j.sna.2025.116317
- Thermal and Reliability-Oriented Structural Optimization of IMS Substrates for Power Module Applications
- Li, T.-H., Zaghari, P., Wang, Y.-J., Fang, J.-K., Chen, J.-C., Shih, P.-S., … Yuan, F.-G. (2025, October 21). , . https://doi.org/10.1109/impact67645.2025.11281709
