Douglas Hopkins
Professor
- Phone: 919-513-5929
- Email: dchopki2@ncsu.edu
- Office: Keystone Science Center 23
- Website: http://www.ece.ncsu.edu/people/dchopki2
Prof. Hopkins has over 20 years of experience in electronic energy systems. His early career was at the R&D centers of the General Electric and Carrier Air-Conditioning Companies in advanced power electronics systems for military and commercial applications up to the low MW range.
Prof. Hopkins received his Ph.D. from Virginia Tech where his research focused on zero-current switching converters and cermet packaging. Prior to joining NCSU, he was at the University at Buffalo (SUNY Buffalo) conducting research in high temperature power electronics (>350˚C) and packaging with aluminum-based composites. At NCSU he created the Laboratory for Packaging Research in Electronic Energy Systems (PREES) focusing on high-temperature, high-frequency, 3D packaging using composite materials primarily for wide band gap power semiconductors (e.g. GaN and SiC) .
Prof Hopkins held Visiting Faculty appointments with the Army, NASA, and the Ohio Space Institute. He was co-founder of DensePower, LLC, and conducts expert witness activities through DCHopkins & Associates, LLC. He has published over 100 journal and conference articles, a number recognized with awards. Further information is available from www.DCHopkins.com
Research Interests
Douglas Hopkins’s research focuses on:
- Very high frequency, high density power electronic systems,
- Extreme environment electronics, and related solid-state protection
- Organic-based circuits for power and energy systems
- High temperature(>300˚C) metal-matrix composite packaging with integrated ceramics
- True 3D electronic packaging with flexible jet patterning
Education
| Degree | Program | School | Year |
|---|---|---|---|
| Ph.D. | Electrical Engineering | Virginia Polytechnic Institute and State University, Blacksburg | 1989 |
Honors and Awards
- 2013 | “Outstanding Educator Award” – International Microelectronics and Packaging Society
- 2007 | Fellow – International Microelectronics and Packaging Society (IMAPS)
- 2001 | “Outstanding Contribution to Education, Research and Professionalism,” IEEE – Region I
- 1999 | IEEE Third Millennium Medal recipient
- 1992 | Senior Member – Institute of Electrical and Electronics Engineers (IEEE)
Publications
- Co-Design and ML-Based Optimization of Through-Via in Silicon and Glass Interposers for Electronic Packaging Applications
- Zaghari, P., Sinha, S. S., Hopkins, D. C., & Ryu, J. E. (2025, January 8), IEEE Transactions on Components Packaging and Manufacturing Technology. https://doi.org/10.1109/TCPMT.2025.3527313
- Design, Fabrication, and Operation Challenges of Advanced Power Packaging Technology for EV Power Modules
- Sinha, S. S., Zaghari, P., Cheng, T.-H., Ryu, J. E., & Hopkins, D. C. (2025, April 8), 2025 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING, IWIPP. https://doi.org/10.1109/IWIPP61784.2025.10971570
- Innovative Packaging Strategy for MLCCs for High Current AC Applications Aimed at Reducing Parasitic Inductance
- Sinha, S. S., Zaghari, P., Ryu, J. E., & Hopkins, D. C. (2025, April 8), 2025 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING, IWIPP. https://doi.org/10.1109/IWIPP61784.2025.10971514
- Novel Integrated Ferromagnetic-Conductor (IFC) Multilayered Shield Layer for Parasitic Reduction in Power Modules
- Sinha, S. S., & Hopkins, D. C. (2025, April 8), 2025 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING, IWIPP. https://doi.org/10.1109/IWIPP61784.2025.10971679
- A 400W, 250kHz (2kW Peak) Integrated GaN Half Bridge Power Module in a Non-Isolated Buck Converter
- Sinha, S. S., Zaghari, P., Ryu, J. E., & Hopkins, D. C. (2024, February 25), 2024 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC, pp. 168–174. https://doi.org/10.1109/APEC48139.2024.10509081
- FET Junction Temperature Monitoring Using Novel On-Chip Solution
- Narwal, R., Agarwal, A., Cheng, T.-H., Baliga, B. J., Bhattacharya, S., & Hopkins, D. C. (2024, February 25), 2024 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC, pp. 2475–2482. https://doi.org/10.1109/APEC48139.2024.10509157
- Investigation of High Current Fine Grain Power Delivery for 3-D Heterogeneous Integration
- Sinha, S. S., Zaghari, P., Ryu, J. E., Batchelor, B., Fillion, R. A., & Hopkins, D. C. (2024, November 21), IEEE Transactions on Components Packaging and Manufacturing Technology, Vol. 14, pp. 2258–2270. https://doi.org/10.1109/TCPMT.2024.3503599
- Advanced GaN IPM for High-Frequency Converter Applications Enabled with Thin-Substrates
- Sinha, S. S., Cheng, T.-H., Parmar, K., & Hopkins, D. C. (2023), 2023 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2023 IEEE Applied Power Electronics Conference and Exposition (APEC). https://doi.org/10.1109/apec43580.2023.10131488
- Analysis and Characterization of Four-quadrant Switches based Commutation Cell
- Narwal, R., Rawat, S., Kanale, A., Cheng, T.-H., Agarwal, A., Bhattacharya, S., … Hopkins, D. C. (2023), 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 2023-March, 209–216. https://doi.org/10.1109/APEC43580.2023.10131312
- Bidirectional Three-phase Current Source Converter based Buck-boost AC/DC System using Bidirectional Switches
- Narwal, R., Bhattacharya, S., Baliga, B. J., & Hopkins, D. C. (2023, June 21), 2023 IEEE TRANSPORTATION ELECTRIFICATION CONFERENCE & EXPO, ITEC. https://doi.org/10.1109/ITEC55900.2023.10186945
